| Kondisi | New and Original |
|---|---|
| Asal | Contact us |
| Distributor | Boser Technology |
| Penghentian Panjang Posting: | 0.130" (3.30mm) |
| Penghentian: | Solder |
| Seri: | Textool™ |
| Pitch - Pos: | 0.070" (1.78mm) |
| Pitch - Kawin: | 0.070" (1.78mm) |
| Nama lain: | 0 54007 46511 9 2641300090602J 3M5049 5400746511 54007465119 JE150093381 |
| Suhu Operasional: | -55°C ~ 125°C |
| Jumlah Pins: | 64 |
| mount Jenis: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Bahan mudah terbakar Penilaian: | UL94 V-0 |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Status Gratis Memimpin / Status RoHS: | Lead free / RoHS Compliant |
| Material perumahan: | Polysulfone (PSU), Glass Filled |
| fitur: | Closed Frame |
| Detil Deskripsi: | IC Socket Adapter DIP, 0.8" (20.32mm) Row Spacing To DIP, 0.8" (20.32mm) Row Spacing Through Hole |
| Peringkat saat ini: | 1A |
| Mengkonversi Untuk (Adapter End): | DIP, 0.8" (20.32mm) Row Spacing |
| Mengkonversi Dari (Adapter End): | DIP, 0.8" (20.32mm) Row Spacing |
| Bahan Kontak - Pos: | Beryllium Copper |
| Bahan Kontak - Kawin: | Beryllium Copper |
| Hubungi Finish Tebal - Pos: | 30.0µin (0.76µm) |
| Hubungi Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Hubungi Selesai - Pos: | Gold |
| Hubungi Finish - Mating: | Gold |
| Bahan papan: | - |
| Email: | [email protected] |
