| Bedingung | New and Original |
|---|---|
| Ursprung | Contact us |
| Verteiler | Boser Technology |
| Beendigung: | Solder |
| Serie: | Textool™ |
| Pitch - Post: | 0.100" (2.54mm) |
| Pitch - Paarung: | 0.100" (2.54mm) |
| Andere Namen: | 0 51138 69608 5 2245248190602J 3M5022 5113869608 51138696085 7100116335 JE150900338 |
| Betriebstemperatur: | -55°C ~ 125°C |
| Anzahl der Pins: | 24 |
| Befestigungsart: | Through Hole |
| Feuchtigkeitsempfindlichkeitsniveau (MSL): | 1 (Unlimited) |
| Material Entflammbarkeit: | UL94 V-0 |
| Hersteller Standard Vorlaufzeit: | 8 Weeks |
| Bleifreier Status / RoHS-Status: | Lead free / RoHS Compliant |
| Gehäusematerial: | Polysulfone (PSU), Glass Filled |
| Eigenschaften: | - |
| detaillierte Beschreibung: | IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole |
| Aktuelle Bewertung: | 1A |
| Wandeln an (Adapterende): | DIP, 0.3" (7.62mm) Row Spacing |
| Wandeln vom (Adapterende): | DIP, 0.3" (7.62mm) Row Spacing |
| Kontakt Material - Post: | Beryllium Copper |
| Kontakt Material - Zusammenpassen: | Beryllium Copper |
| Kontakt Finish Dicke - Post: | 30.0µin (0.76µm) |
| Kontakt-Finish-Dicke - Paarung: | 30.0µin (0.76µm) |
| Kontakt Finish - Post: | Gold |
| Kontakt Finish - Paarung: | Gold |
| Board-Material: | - |
| Email: | [email protected] |
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