EPC2100ENG
EPC2100ENG
Part Number:
EPC2100ENG
Manufacturer:
EPC
Description:
TRANS GAN 2N-CH 30V BUMPED DIE
[LeadFreeStatus]未找到翻译
Lead free / RoHS Compliant
Quantity:
78624 Pieces
Delivery Time:
1-2 days
Data sheet:
EPC2100ENG.pdf

Introduction

EPC2100ENG best price and fast delivery.
BOSER Technology is the distributor for EPC2100ENG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2100ENG by email, we will give you a best price according your plan.
Our email: [email protected]

Specifications

Condition New and Original
Origin Contact us
Distributor Boser Technology
Vgs(th) (Max) @ Id:2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package:Die
Series:eGaN®
Rds On (Max) @ Id, Vgs:8.2 mOhm @ 25A, 5V, 2.1 mOhm @ 25A, 5V
Power - Max:-
Packaging:Tray
Package / Case:Die
Other Names:917-EPC2100ENG
EPC2100ENGR_H1
EPC2100ENGRH1
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Input Capacitance (Ciss) (Max) @ Vds:475pF @ 15V, 1960pF @ 15V
Gate Charge (Qg) (Max) @ Vgs:4.9nC @ 15V, 19nC @ 15V
FET Type:2 N-Channel (Half Bridge)
FET Feature:GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss):30V
Detailed Description:Mosfet Array 2 N-Channel (Half Bridge) 30V 10A (Ta), 40A (Ta) Surface Mount Die
Current - Continuous Drain (Id) @ 25°C:10A (Ta), 40A (Ta)
Email:[email protected]

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