EPC2012CENGR
EPC2012CENGR
Part Number:
EPC2012CENGR
Manufacturer:
EPC
Description:
TRANS GAN 200V 5A BUMPED DIE
[LeadFreeStatus]未找到翻译
Lead free / RoHS Compliant
Quantity:
81136 Pieces
Delivery Time:
1-2 days
Data sheet:
EPC2012CENGR.pdf

Introduction

EPC2012CENGR best price and fast delivery.
BOSER Technology is the distributor for EPC2012CENGR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2012CENGR by email, we will give you a best price according your plan.
Our email: [email protected]

Specifications

Condition New and Original
Origin Contact us
Distributor Boser Technology
Voltage - Test:100pF @ 100V
Voltage - Breakdown:Die Outline (4-Solder Bar)
Vgs(th) (Max) @ Id:100 mOhm @ 3A, 5V
Technology:GaNFET (Gallium Nitride)
Series:eGaN®
RoHS Status:Tape & Reel (TR)
Rds On (Max) @ Id, Vgs:5A (Ta)
Polarization:Die
Other Names:917-EPC2012CENGRTR
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Part Number:EPC2012CENGR
Input Capacitance (Ciss) (Max) @ Vds:1nC @ 5V
Gate Charge (Qg) (Max) @ Vgs:2.5V @ 1mA
FET Feature:N-Channel
Expanded Description:N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar)
Drain to Source Voltage (Vdss):-
Description:TRANS GAN 200V 5A BUMPED DIE
Current - Continuous Drain (Id) @ 25°C:200V
Capacitance Ratio:-
Email:[email protected]

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