| Condition | New and Original |
|---|---|
| Origin | Contact us |
| Distributor | Boser Technology |
| Vgs(th) (Max) @ Id: | 2.5V @ 3mA |
| Vgs (Max): | +6V, -4V |
| Technology: | GaNFET (Gallium Nitride) |
| Supplier Device Package: | Die Outline (7-Solder Bar) |
| Series: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 25 mOhm @ 12A, 5V |
| Power Dissipation (Max): | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Die |
| Other Names: | 917-1085-2 |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Input Capacitance (Ciss) (Max) @ Vds: | 540pF @ 100V |
| Gate Charge (Qg) (Max) @ Vgs: | 5.3nC @ 5V |
| FET Type: | N-Channel |
| FET Feature: | - |
| Drive Voltage (Max Rds On, Min Rds On): | 5V |
| Drain to Source Voltage (Vdss): | 200V |
| Detailed Description: | N-Channel 200V 22A (Ta) Surface Mount Die Outline (7-Solder Bar) |
| Current - Continuous Drain (Id) @ 25°C: | 22A (Ta) |
| Email: | [email protected] |
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EPC2010 | EPC | TRANS GAN 200V 12A BUMPED DIE | Inquiry |
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EPC2007C | EPC | TRANS GAN 100V 6A BUMPED DIE | Inquiry |
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EPC1PI8 | Altera (Intel® Programmable Solutions Group) | IC CONFIG DEVICE 1MBIT 8DIP | Inquiry |
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EPC2012C | EPC | TRANS GAN 200V 5A BUMPED DIE | Inquiry |
|
EPC2014 | EPC | TRANS GAN 40V 10A BUMPED DIE | Inquiry |
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EPC2001C | EPC | TRANS GAN 100V 36A BUMPED DIE | Inquiry |
|
EPC2014C | EPC | TRANS GAN 40V 10A BUMPED DIE | Inquiry |
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EPC2016 | EPC | TRANS GAN 100V 11A BUMPED DIE | Inquiry |
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EPC2012CENGR | EPC | TRANS GAN 200V 5A BUMPED DIE | Inquiry |
|
EPC2015C | EPC | TRANS GAN 40V 33A BUMPED DIE | Inquiry |
|
EPC2012 | EPC | TRANS GAN 200V 3A BUMPED DIE | Inquiry |
|
EPC1PI8N | Altera (Intel® Programmable Solutions Group) | IC CONFIG DEVICE 1MBIT 8DIP | Inquiry |
|
EPC1PC8 | Altera (Intel® Programmable Solutions Group) | IC CONFIG DEVICE 1MBIT 8DIP | Inquiry |
|
EPC2015 | EPC | TRANS GAN 40V 33A BUMPED DIE | Inquiry |
|
EPC1PC8CC | Altera (Intel® Programmable Solutions Group) | IC CONFIG DEVICE | Inquiry |
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EPC1LI20N | Altera (Intel® Programmable Solutions Group) | IC CONFIG DEVICE 1MBIT 20PLCC | Inquiry |
|
EPC2001 | EPC | TRANS GAN 100V 25A BUMPED DIE | Inquiry |
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EPC2015CENGR | EPC | TRANS GAN 40V 36A BUMPED DIE | Inquiry |
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EPC2010CENGR | EPC | TRANS GAN 200V 22A BUMPED DIE | Inquiry |
|
EPC2007 | EPC | TRANS GAN 100V 6A BUMPED DIE | Inquiry |