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Home > Products > Integrated Circuits (ICs) > Interface - Telecom > DS34S132GN+
DS34S132GN+
DS34S132GN+
Part Number:
DS34S132GN+
Manufacturer:
Maxim Integrated
Description:
IC TDM OVER PACKET 676-BGA
[LeadFreeStatus]未找到翻译
Lead free / RoHS Compliant
Quantity:
65249 Pieces
Delivery Time:
1-2 days
Data sheet:
DS34S132GN+.pdf
Inquiry

Introduction

DS34S132GN+ best price and fast delivery.
BOSER Technology is the distributor for DS34S132GN+, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS34S132GN+ by email, we will give you a best price according your plan.
Our email: [email protected]

Specifications

Condition New and Original
Origin Contact us
Distributor Boser Technology
Voltage - Supply:1.8V, 3.3V
Supplier Device Package:676-TEPBGA (27x27)
Series:-
Packaging:Tray
Package / Case:676-BGA
Other Names:90-34S13+2N0
Operating Temperature:-40°C ~ 85°C
Number of Circuits:1
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):3 (168 Hours)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Interface:TDMoP
Includes:-
Function:TDM-over-Packet (TDMoP)
Detailed Description:Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
Current - Supply:-
Base Part Number:DS34S132
Email:[email protected]

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