| Kondisi | New and Original |
|---|---|
| Asal | Contact us |
| Distributor | Boser Technology |
| tegangan Penilaian: | - |
| Penghentian: | Solder Cup |
| Gaya: | Board to Board |
| Seri: | 853 |
| Row Spacing - Mating: | 0.050" (1.27mm) |
| Pitch - Kawin: | 0.050" (1.27mm) |
| Pengemasan: | Bulk |
| Nama lain: | ED10351 |
| Suhu Operasional: | -55°C ~ 125°C |
| Jumlah baris: | 2 |
| Jumlah Posisi Loaded: | All |
| Jumlah Posisi: | 14 |
| mount Jenis: | Through Hole |
| Moisture Sensitivity Level (MSL): | Not Applicable |
| Bahan mudah terbakar Penilaian: | UL94 V-0 |
| Kawin Stacking Heights: | - |
| Manufacturer Standard Lead Time: | 4 Weeks |
| Diferensial Transmisi Data: | Thermoplastic |
| Isolasi Tinggi: | 0.149" (3.78mm) |
| Warna Isolasi: | Black |
| Perlindungan ingress: | - |
| fitur: | - |
| pengikatan Jenis: | Push-Pull |
| Detil Deskripsi: | 14 Position Receptacle Connector Through Hole |
| Peringkat saat ini: | 3A |
| Hubungi Type: | Female Socket |
| Formulir kontak: | Circular |
| kontak Material: | Beryllium Copper |
| Panjang Kontak - Pos: | 0.191" (4.85mm) |
| Hubungi Finish Tebal - Pos: | 10.0µin (0.25µm) |
| Hubungi Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Hubungi Selesai - Pos: | Gold |
| Hubungi Finish - Mating: | Gold |
| Jenis konektor: | Receptacle |
| Aplikasi: | - |
| Email: | [email protected] |
