XCZU11EG-1FFVB1517I
Part Number:
XCZU11EG-1FFVB1517I
Manufacturer:
Xilinx
Description:
IC FPGA 488 I/O 1517FCBGA
[LeadFreeStatus]未找到翻译
Lead free / RoHS Compliant
Quantity:
45878 Pieces
Delivery Time:
1-2 days
Data sheet:
XCZU11EG-1FFVB1517I.pdf

Introduction

XCZU11EG-1FFVB1517I best price and fast delivery.
BOSER Technology is the distributor for XCZU11EG-1FFVB1517I, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XCZU11EG-1FFVB1517I by email, we will give you a best price according your plan.
Our email: [email protected]

Specifications

Condition New and Original
Origin Contact us
Distributor Boser Technology
Supplier Device Package:1517-FCBGA (40x40)
Speed:500MHz, 600MHz, 1.2GHz
Series:Zynq® UltraScale+™ MPSoC EG
RAM Size:256KB
Primary Attributes:Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Peripherals:DMA, WDT
Packaging:Tray
Package / Case:1517-BBGA, FCBGA
Operating Temperature:-40°C ~ 100°C (TJ)
Number of I/O:488
Moisture Sensitivity Level (MSL):4 (72 Hours)
Manufacturer Standard Lead Time:10 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Flash Size:-
Detailed Description:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 1517-FCBGA (40x40)
Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture:MCU, FPGA
Email:[email protected]

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