32-6554-18
Part Number:
32-6554-18
Manufacturer:
Aries Electronics, Inc.
Description:
CONN IC DIP SOCKET ZIF 32POS
[LeadFreeStatus]未找到翻译
Lead free / RoHS Compliant
Quantity:
89662 Pieces
Delivery Time:
1-2 days
Data sheet:
32-6554-18.pdf

Introduction

32-6554-18 best price and fast delivery.
BOSER Technology is the distributor for 32-6554-18, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 32-6554-18 by email, we will give you a best price according your plan.
Our email: [email protected]

Specifications

Condition New and Original
Origin Contact us
Distributor Boser Technology
Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Termination Post Length:0.110" (2.78mm)
Termination:Solder
Series:55
Pitch - Post:0.100" (2.54mm)
Pitch - Mating:0.100" (2.54mm)
Packaging:Bulk
Operating Temperature:-55°C ~ 250°C
Number of Positions or Pins (Grid):32 (2 x 16)
Mounting Type:Through Hole
Moisture Sensitivity Level (MSL):1 (Unlimited)
Material Flammability Rating:UL94 V-0
Manufacturer Standard Lead Time:6 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Housing Material:Polyetheretherketone (PEEK), Glass Filled
Features:Closed Frame
Current Rating:1A
Contact Resistance:-
Contact Material - Post:Beryllium Nickel
Contact Material - Mating:Beryllium Nickel
Contact Finish Thickness - Post:50.0µin (1.27µm)
Contact Finish Thickness - Mating:50.0µin (1.27µm)
Contact Finish - Post:Nickel Boron
Contact Finish - Mating:Nickel Boron
Email:[email protected]

Quick Request Quote

Part Number
Quantity
Company
E-mail
Phone
Comments