28-3575-11
Part Number:
28-3575-11
Manufacturer:
Aries Electronics, Inc.
Description:
CONN IC DIP SOCKET ZIF 28POS GLD
[LeadFreeStatus]未找到翻译
Lead free / RoHS Compliant
Quantity:
55938 Pieces
Delivery Time:
1-2 days
Data sheet:
28-3575-11.pdf

Introduction

28-3575-11 best price and fast delivery.
BOSER Technology is the distributor for 28-3575-11, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 28-3575-11 by email, we will give you a best price according your plan.
Our email: [email protected]

Specifications

Condition New and Original
Origin Contact us
Distributor Boser Technology
Type:DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Termination Post Length:0.110" (2.78mm)
Termination:Solder
Series:57
Pitch - Post:0.100" (2.54mm)
Pitch - Mating:0.100" (2.54mm)
Packaging:Bulk
Operating Temperature:-
Number of Positions or Pins (Grid):28 (2 x 14)
Mounting Type:Through Hole
Moisture Sensitivity Level (MSL):1 (Unlimited)
Material Flammability Rating:UL94 V-0
Manufacturer Standard Lead Time:5 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Features:Closed Frame
Current Rating:1A
Contact Resistance:-
Contact Material - Post:Beryllium Copper
Contact Material - Mating:Beryllium Copper
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Finish - Post:Gold
Contact Finish - Mating:Gold
Email:[email protected]

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