| Kondisi | New and Original |
|---|---|
| Asal | Contact us |
| Distributor | Boser Technology |
| tegangan Penilaian: | - |
| Penghentian: | Solder |
| Gaya: | Board to Cable/Wire |
| Seri: | Micro SLP |
| Row Spacing - Mating: | - |
| Pitch - Kawin: | 0.031" (0.80mm) |
| Pengemasan: | Tape & Reel (TR) |
| Suhu Operasional: | - |
| Jumlah baris: | 1 |
| Jumlah Posisi Loaded: | All |
| Jumlah Posisi: | 2 |
| mount Jenis: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Bahan mudah terbakar Penilaian: | - |
| Kawin Stacking Heights: | 1.4mm |
| Status Gratis Memimpin / Status RoHS: | Lead free / RoHS Compliant |
| Diferensial Transmisi Data: | Liquid Crystal Polymer (LCP), Halogen Free |
| Isolasi Tinggi: | 0.055" (1.40mm) |
| Warna Isolasi: | - |
| Perlindungan ingress: | - |
| fitur: | Pick and Place, Solder Retention |
| pengikatan Jenis: | Detent Lock |
| Detil Deskripsi: | 2 Position Receptacle Connector Surface Mount |
| Peringkat saat ini: | 1A |
| Hubungi Type: | Outer Shroud Contact |
| Formulir kontak: | - |
| kontak Material: | Phosphor Bronze |
| Panjang Kontak - Pos: | - |
| Hubungi Finish Tebal - Pos: | 1.97µin (0.050µm) |
| Hubungi Finish Thickness - Mating: | 12.0µin (0.30µm) |
| Hubungi Selesai - Pos: | Gold |
| Hubungi Finish - Mating: | Gold |
| Jenis konektor: | Receptacle |
| Aplikasi: | General Purpose, Telecommunications |
| Email: | [email protected] |
