XCZU9CG-L2FFVC900E
Part Number:
XCZU9CG-L2FFVC900E
Manufacturer:
Xilinx
Description:
IC FPGA 204 I/O 900FCBGA
[LeadFreeStatus]未找到翻译
Lead free / RoHS Compliant
Quantity:
69949 Pieces
Delivery Time:
1-2 days
Data sheet:
XCZU9CG-L2FFVC900E.pdf

Introduction

XCZU9CG-L2FFVC900E best price and fast delivery.
BOSER Technology is the distributor for XCZU9CG-L2FFVC900E, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XCZU9CG-L2FFVC900E by email, we will give you a best price according your plan.
Our email: [email protected]

Specifications

Condition New and Original
Origin Contact us
Distributor Boser Technology
Supplier Device Package:900-FCBGA (31x31)
Speed:533MHz, 1.3GHz
Series:Zynq® UltraScale+™ MPSoC CG
RAM Size:256KB
Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Peripherals:DMA, WDT
Packaging:Tray
Package / Case:900-BBGA, FCBGA
Operating Temperature:0°C ~ 100°C (TJ)
Number of I/O:204
Moisture Sensitivity Level (MSL):4 (72 Hours)
Manufacturer Standard Lead Time:10 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Flash Size:-
Detailed Description:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 256KB 533MHz, 1.3GHz 900-FCBGA (31x31)
Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture:MCU, FPGA
Email:[email protected]

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